Here is the translated content regarding the future development trends of three different processes for diode chip manufacturing:

As semiconductor technology advances toward smaller scales, the photoresist process will continuously improve precision to achieve higher-resolution patterning, meeting the nanometer-level precision requirements of diode chips. It may break through the current nanometer precision limits, further reducing chip feature sizes and improving integration density.

It will actively integrate with new semiconductor materials, 3D integration, and other advanced technologies. For example, in the manufacturing of diode chips using new materials like compound semiconductors, the high-precision advantages of the photoresist process will be leveraged to fabricate high-performance devices. Meanwhile, it will assist 3D integration technologies in precisely manufacturing multi-layer diode chips, enhancing device performance and functionality.

Although photoresist process equipment is expensive and the workflow is complex, unit costs are expected to gradually decrease with technological maturity and economies of scale. Additionally, cost reduction and improved cost-effectiveness through process improvements and equipment localization will enable its wider application in more fields.

Due to inherent defects such as low film thickness control precision and poor reliability, the knife coating process will be gradually replaced by more advanced technologies like the photoresist process in fields with high requirements for diode chip performance and reliability, such as automotive electronics and industrial control.

In low-end consumer electronics fields that are extremely cost-sensitive and have low requirements for chip performance (e.g., simple toy circuits, disposable electronic products), the knife coating process may still be retained for a certain period due to its advantages of simple process and low cost.

Key performance indicators such as film layer uniformity, voltage resistance, and anti-aging capability are expected to be improved through material R&D and process optimization. For example, developing new electrophoresis materials and adjusting electrophoresis solution formulations and process parameters can make the deposited passivation layer more uniform and dense, thereby enhancing the performance and reliability of diode chips.

It may be combined with other surface treatment or chip manufacturing processes to form composite processes, making up for its own limitations and leveraging synergistic advantages. For instance, the electrophoresis process can be used for initial passivation layer deposition, followed by subsequent heat treatment or other surface modification processes to further improve the quality and performance of the passivation layer.

Given the high environmental protection costs and difficult waste treatment in the electrophoresis process, future improvements are needed in environmental protection, including developing more eco-friendly electrophoresis materials and waste liquid treatment technologies to reduce environmental impact and meet increasingly strict environmental requirements.